Structural Design Differences50W, 100W, and 200W Low-PIM termination loads demonstrate significant structural variations to address distinct thermal management needs. 50W units employ compact aluminum housings with basic fin structures, relying on natural convection cooling. The internal design features standard resistor elements on ceramic substrates with simple spring contacts.100W terminations incorporate enhanced thermal management through extended fin designs and copper-tungsten heat spreaders. The internal architecture upgrades to specialized alloy resistors on high-thermal-conductivity substrates like aluminum nitride, with reinforced contact systems for better thermal cycling tolerance.200W models represent the most advanced engineering with heat pipe technology or vapor chambers. These units utilize copper alloy housings and sophisticated internal designs featuring custom resistor compositions on premium ceramic substrates. The mechanical structure includes substantial reinforcement and specialized connector interfaces for maximum durability.Performance and Application ScopeWhile all variants maintain excellent PIM performance (-150 dBc to -160 dBc), their capabilities differ substantially. 50W terminations suit indoor DAS and small cell applications where space efficiency is prioritized. 100W models serve macro cell base stations and medium-scale DAS, offering balanced performance for continuous operation. 200W units meet the demands of high-power broadcast and large-scale infrastructure where reliability under maximum load is critical.The structural progression reflects a careful balance between power handling, physical size, and application requirements. Understanding these differences ensures optimal component selection for specific wireless system needs.
